Modeling and Analyzing Coupling Noise Effect of Cu-Carbon Nanotube Composite Through-Silicon Vias Interconnects Using NILT Based - Détails de la publication

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Modeling and Analyzing Coupling Noise Effect of Cu-Carbon Nanotube Composite Through-Silicon Vias Interconnects Using NILT Based

Auteur

Belaid, K.A., Belahrach, H., Ayad, H., Ez-Zaki, F.

Revue

Serbian Journal of Electrical Engineering

Année

2023

DOI

10.2298/SJEE2303301A

Chercheur

AYAD Hassan

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