Computing and Analyzing the Through Silicon Via (TSV) Noise Coupling in 3D-IC Structures

Auteur

Khaoula Ait Belaid, Hassan Belahrach, Hassan Ayad and Fatima EzZaki

Manifestation

International Conference on Digital Technologies and Applications January 29-30, 2021, Fez, Morocco ICDTA’21.

Date

2020-1-29

Organisation

Fez, Morocco

Chercheur

AYAD Hassan

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